AUTO-ALIGNMENT MECHANISM FOR MULTI-LAYER SUBSTRATE AND MACHINE FOR INDUCTION BONDING MULTI-LAYER SUBSTRATE TEMPORARILY

摘要

An auto-alignment mechanism for multi-layer substrate and machine for induction bonding multi-layer substrate temporarily are improve is provided to improve the precision of the multilayer board by the analysis and optical processing of image. The fixing plate(122) of the UVW stage(120) is securely fixed to the bottom surface of the post. The UVW stage is made of the UVW driver(124) and driving plate(126). The housing(132) of the main-cylinder(130) is fixed to the penetration hole(128) of the driving plate. The main-cylinder comprises the piston rod(3) moving up and down. The vacuum chuck(140) comprises the sub-cylinder(144) installed at the upper plate(142) and the lower plate(146) combined with the sub-cylinder.