POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION

摘要

A positive photosensitive resin composition is provided to be curable at a temperature of 260 ‹C or less, to ensure excellent sensitivity, resolution, pattern forming ability, and to exhibit low film shrinkage rate and excellent film characteristic. A positive photosensitive resin composition comprises: (A) 100.0 parts by weight of a polyamic acid or polyamic acid ester compound having repeating units represented by chemical formula 1; (B) a photosensitive diazoquinone 5-100.0 parts by weight; (C) a silane compound 0.1-30 parts by weight; (D) a phenolic compound 1-30 parts by weight; and (E) solvent 50-200 parts by weight. The polyamic acid or the poly amic acid ester compound has the average molecular weight(Mw) of 3,000-300,000.