PACKAGING FOR AN INTERFEROMETRIC MODULATOR

摘要

PACKAGING FOR AN INTERFEROMETRIC MODULATOR A PACKAGE IS MADE OF A TRANSPARENT SUBSTRATE (12) HAVING AN INTERFEROMETRIC MODULATOR (10) AND A BACK PLATE (30). A NON-HERMETIC SEAL (32) JOINS THE BACK PLATE TO THE SUBSTRATE TO FORM A PACKAGE, AND A DESICCANT RESIDES INSIDE THE PACKAGE. A METHOD OF PACKAGING AN INTERFEROMETRIC MODULATOR INCLUDES PROVIDING A TRANSPARENT SUBSTRATE AND MANUFACTURING AN INTERFEROMETRIC MODULATOR ARRAY ON A BACKSIDE OF THE SUBSTRATE. A BACK PLATE IS PROVIDED AND A DESICCANT IS APPLIED TO THE BACK PLATE. THE BACK PLATE IS SEALED TO THE BACKSIDE OF THE SUBSTRATE WITH A BACK SEAL IN AMBIENT CONDITIONS, THEREBY FORMING A PACKAGE.