| 摘要 |
<p>A device for processing the surface of copper chip is provided to improve adhesive property between the copper chips in a molding process, and to process the surface roughly by processing the surface repetitively with impact friction. A device for processing the surface of a copper chip comprises a copper chip feed hopper(1), a first hopper(3), a rotating plate, a friction rod, a second hopper(3a), and a processor main body(7). The copper chip is transferred to the first hopper from the copper chip supply hopper. The first hopper is supplied to the rotating plate of the main body. The copper chip is processed by friction impact. The processed copper chip is received in the second hopper.</p> |
