SEMICONDUCTOR PACKAGE

摘要

A semiconductor package is provided to prevent the solder ball from being circuit-shorted by electrically connecting the semiconductor devices through an interposer. The first semiconductor die(120) is formed on the top of the first circuit substrate(110). An interposer(130) is formed on the top of the first semiconductor die. The first semiconductor device(100) has one or more first solder ball that electrically connects the interposer and the first circuit substrate. The second semiconductor device(200) has the second semiconductor die(220) formed on the top of the second circuit substrate. The second circuit substrate(210) is formed on the top of the first semiconductor device and is electrically connected to the interposer and the first circuit substrate.