| 摘要 |
PROBLEM TO BE SOLVED: To pinch a portion where no semiconductor chips are loaded by a mold comprising an upper die and a lower die, thereby reducing a generation of a resin burr. SOLUTION: This resin sealing method seals a circuit board 10 adhering a semiconductor chip 1 by a liquid resin 31 by use of a mold 21 comprising an upper die 21a and a lower die 21b, and when a portion where no semiconductor chips 1 of the circuit board 10 are loaded is pinched by the mold 21 comprising the upper die 21a and the lower die 21b, in the upper die 21a forming a cavity 26, a nesting 22 made of a fluororesin is provided to the cavity 26 side. Further, this resin sealing method contains the steps of: clamping the mold 21 so that the nesting 22 faces a loading face of the semiconductor chips 1 of the circuit board 10; and pouring the liquid resin 31 into the cavity 26 at a low pressure. COPYRIGHT: (C)2009,JPO&INPIT
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