HEAT DISSIPATING METHOD, HEAT DISSIPATING APPARATUS, SEMICONDUCTOR CHIP, AND ELECTRONIC EQUIPMENT

摘要

PROBLEM TO BE SOLVED: To provide a heat dissipating method and a heat dissipating apparatus which do not invite an increase in power consumption and provide high cooling and heat dissipation efficiency, and to provide a semiconductor chip and electronic equipment that have the heat dissipating apparatus. SOLUTION: The heat dissipating apparatus circulates a cooling medium liquid between a heater 1 and a heat exchanger 4 by a cooling medium circulating pump 5 so that heat generated by the heater 1 is dissipated by the heat exchanger 4. The heat dissipating apparatus includes a thermoelectric conversion element 6 that converts a temperature difference between a high-temperature cooling medium liquid pipeline through which the cooling medium liquid at high temperature flows and a low-temperature cooling medium liquid pipeline through which the cooling medium liquid at low temperature flows, into electric power. COPYRIGHT: (C)2009,JPO&INPIT