| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device, in which a semiconductor element mounting substrate is bonded onto an island portion of a lead frame through a silicone-based thermosetting adhesive, wherein the sticking of an outgas component of the silicone-based thermosetting adhesive on a lead portion can be stably suppressed at low cost, and high reliability can be secured in a subsequent wire bonding stage. <P>SOLUTION: When the semiconductor element mounting substrate 2 is bonded onto the island portion 1i of the lead frame 1 through the silicone-based thermosetting adhesive 3, set temperatures T2a and T2b of lead portions 1a and 1b, respectively, of the lead frame 1 are set higher than a set temperature T2i of the island portion 1i. <P>COPYRIGHT: (C)2009,JPO&INPIT |
