摘要 |
PROBLEM TO BE SOLVED: To provide means for easily discriminating each of integrated circuits having the same shape and different functions only at a glance after the integrated circuits are mounted on film substrates having the same shape. SOLUTION: An integrated circuit mounting package 140 having a SOF structure includes an identification mark describing part 1, and accordingly, the model name can be written after an integrated circuit 101 is mounted. Consequently, when integrated circuits 101A having the same shape and different functions are mounted on film substrates, corresponding model names can be written after they are mounted. COPYRIGHT: (C)2009,JPO&INPIT
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