发明名称 PLASMA PROCESSING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To prevent that a solid dielectric layer is damaged by a heat shock or the like in a plasma surface processing. <P>SOLUTION: Electrodes 11, 12 are arranged at a processing head 10, and a discharge forming face of these electrodes 11, 12 are respectively covered by the solid dielectric layers 13, 14. A temperature sensor 30 is arranged at a place corresponding to the center part of the longitudinal direction of the electrodes 11, 12, and its detected result is input into a control part 5. The control part 5 controls supply electric power from a power supply 3 based on a detected value of the sensor 30. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009193741(A) 申请公布日期 2009.08.27
申请号 JP20080031292 申请日期 2008.02.13
申请人 SEKISUI CHEM CO LTD 发明人 TAKEUCHI HIROTO
分类号 H05H1/24;B08B7/00;H01L21/304;H01L21/3065 主分类号 H05H1/24
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