| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve work efficiency by reducing the number of steps of an interlayer connection process. <P>SOLUTION: A wiring base layer 9 is formed at a position corresponding to the connections of underlying wiring 5 and overlying wiring 6 out of positions on a base substrate 2 where the underlying wiring 5 is formed, the underlying wiring 5 is formed on the base substrate 2, a cap metal layer 10 is formed at an optional part on the surface of the underlying wiring 5, an interlayer dielectric 12 is formed on the base substrate 2 to cover the underlying wiring 5, the surface of the interlayer dielectric 12 is smoothed by polishing the surface of the interlayer dielectric 12, and the surface of the cap metal layer 10 in an optional underlying wiring 5 is exposed, and then the overlying wiring 6 is laminated on the exposed cap metal layer 10. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
