发明名称 |
INTEGRATED CIRCUIT DEVICE COMPRISING CONDUCTIVE VIAS AND METHOD OF MAKING THE SAME |
摘要 |
A semiconductor substrate for an integrated circuit device comprises at least one insulating substrate region being formed of a cohesive insulating material. The insulating substrate region includes at least two conductive vias extending at least between a first surface and a second surface of the insulating substrate region. |
申请公布号 |
US2009212438(A1) |
申请公布日期 |
2009.08.27 |
申请号 |
US20080037403 |
申请日期 |
2008.02.26 |
申请人 |
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发明人 |
KREUPL FRANZ;HEDLER HARRY |
分类号 |
H01L23/522;H01L21/768 |
主分类号 |
H01L23/522 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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