发明名称 POSITIVE RESIST COMPOSITION FOR USE WITH ELECTRON BEAM, X-RAY OR EUV AND PATTERN FORMING METHOD USING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To solve the problems regarding a technique for improving performances in microfabrication of a semiconductor element using actinic rays or radiation, in particular, electron beam, X-ray or EUV light, and to positive a positive resist composition which includes high sensitivity which is less likely to be affected by variation in exposure energy, that is, includes high EL, and exhibits proper temporal stability, and to provide a pattern forming method that uses the composition. <P>SOLUTION: The positive resist composition for use with electron beam, X-ray or EUV includes: a resin capable of decomposing under an action of an acid to increase a dissolution rate in an aqueous alkali solution; a compound, capable of generating an acid upon irradiation with actinic rays or radiation; a basic compound; and an organic solvent, wherein the entire solid content concentration in the composition is 1.0-4.5 mass% and a ratio of the compound, capable of generating an acid upon irradiation with actinic rays or radiation is 10-50 mass%, based on the entire solid content. The pattern forming method using the composition is also provided. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009192735(A) 申请公布日期 2009.08.27
申请号 JP20080032154 申请日期 2008.02.13
申请人 FUJIFILM CORP 发明人 YAMASHITA KATSUHIRO
分类号 G03F7/039;G03F7/004;H01L21/027 主分类号 G03F7/039
代理机构 代理人
主权项
地址