发明名称 ENERGY BEAM BORING METHOD, LIQUID DROPLET DISCHARGING HEAD MANUFACTURING METHOD USING THE SAME, AND ENERGY BEAM BORING DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an energy beam boring method which prevents a recess from being formed through irradiation of energy beam while suppressing the increase of cost and processing time and is capable of forming a plurality of minute holes on a member to be processed at high density. <P>SOLUTION: An irradiation area 47 at the member 11 to be processed is moved in an alignment direction in a through-hole pattern to allow the energy beam L to make the irradiation areas 47 formed on the member 11 partially overlap with each other using a shielding mechanism 43 for enabling a shielding member 44 to be inserted into/removed from a light path. A plurality of through-holes 15 are formed by sequentially increasing depth dimension through sequential irradiation of the energy beam L onto the member 11. The shielding mechanism 43 inserts the shielding member 44 into the light path corresponding to the movement of the irradiation area 47 at the member 11 to prevent the energy beam L which does not contribute to the formation of a through-hole 15 at the irradiation area 47 from being irradiated to the member 11. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2009190054(A) 申请公布日期 2009.08.27
申请号 JP20080032541 申请日期 2008.02.14
申请人 RICOH CO LTD 发明人 UMEZAWA MICHIO
分类号 B23K26/38;B23K26/00;B23K26/06;B41J2/135 主分类号 B23K26/38
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