| 摘要 |
PROBLEM TO BE SOLVED: To provide a connection structure between microwave units for reducing deterioration of RF characteristics. SOLUTION: In this connection structure between microwave units, a first microwave unit 6 includes an exposed part 26A in a first conductor layer 13 of the lower layer of a first microstrip line. A second microwave unit 7 includes an exposed part 26B in a second conductor layer 16 of the lower layer of a second microstrip line. An electronic component 10 is brought into contact with and mounted to the exposed part 26A and the exposed part 26B, straddling a gap 25 between the first conductor layer 13 of the first microwave unit 6 and the second conductor layer 16 of the second microwave unit. COPYRIGHT: (C)2009,JPO&INPIT
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