发明名称 BRAZING FILLER, ELECTRONIC DEVICE, AND SEALING METHOD OF ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To secure a melting point and a brazing property while reducing a weight ratio of Au in a brazing filler of an Au-Ag-Sn alloy. SOLUTION: Composition ratio of [Au (wt%), Ag (wt%), Sn (wt%)] of the brazing filler is in an area surrounded by a line which connects 6 points of point 1 (53.0, 23.5, 23.5), point 2 (65.9, 12.3, 21.8), point 3 (66.1, 15.0, 18.9), point 4 (67.3, 19.1, 13.6), point 5 (45.5, 39.0, 15.5), point 6 (49.6, 28.7, 21.7) and the balance thereof is an unavoidable component. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009190055(A) 申请公布日期 2009.08.27
申请号 JP20080032736 申请日期 2008.02.14
申请人 SEIKO EPSON CORP 发明人 TAKAHASHI SHOJI
分类号 B23K35/30;B22F9/08;B23K1/00;B23K1/14;B23K3/06;B23K101/40;C22C5/02;H01L23/02 主分类号 B23K35/30
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