| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper-silver brazing filler metal, which has excellent joint property to Fe-Ni based metal and copper based metal to be used for the lid or the like for sealing the ceramic case of the package for the electronic component, and a cladding material for the lid of a package for an electronic component. SOLUTION: The invented brazing filler metal has a laminated structure in which one surface or both surfaces of a Cu-P alloy layer 2 formed of Cu-P alloy is cladded with Cu-Ag layers 3 formed of Cu-Ag alloy. The Cu-P alloy includes 2.0-3.2% P and the balance of Cu and impurities. The Cu-Ag alloy includes 40-90% Ag and the balance of Cu and impurities. The brazing filler metal has an average composition comprising 1.5-3.0% P, 15.0-35% Ag and the balance of Cu and impurities in the laminating direction. The brazing filler metal may have not only the laminated structure, but also the composition as a single material. COPYRIGHT: (C)2009,JPO&INPIT |
