发明名称 METHOD FOR MANUFACTURING INTERPOSER
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing an interposer capable of more accurate alignment by preventing the warpage of a substrate. SOLUTION: A plurality of laminated bodies in which wiring layers are formed on both faces of an insulative base material are prepared, and on a supporting substrate, adhesive layers are placed between the supporting substrate and the laminates, and between a couple of the laminates to layer a plurality of the laminated body, and these are altogether glued. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009192439(A) 申请公布日期 2009.08.27
申请号 JP20080035365 申请日期 2008.02.15
申请人 JAPAN ELECTRONIC MATERIALS CORP 发明人 MORITA KUNIYUKI
分类号 G01R1/073;H01L23/12;H01R11/01 主分类号 G01R1/073
代理机构 代理人
主权项
地址