发明名称 |
METHOD OF MANUFACTURING SOLID-STATE IMAGE PICKUP ELEMENT, AND SOLID-STATE IMAGE PICKUP ELEMENT |
摘要 |
Disclosed herein is a method of manufacturing a solid-state image pickup element, the method including the steps of forming a plurality of photoelectric conversion elements within a semiconductor substrate; forming a wiring layer via an insulating film on a surface of the semiconductor substrate in which surface the plurality of photoelectric conversion elements are formed; laminating a supporting substrate to a surface of the semiconductor substrate in which surface the wiring layer is formed via an adhesive; applying a pressure to the semiconductor substrate and the supporting substrate in a state of the semiconductor substrate and the supporting substrate being laminated to each other via the adhesive; and curing the adhesive by heating the adhesive to a curing temperature of the adhesive after releasing the applied pressure.
|
申请公布号 |
US2009212384(A1) |
申请公布日期 |
2009.08.27 |
申请号 |
US20090364254 |
申请日期 |
2009.02.02 |
申请人 |
SONY CORPORATION |
发明人 |
KOBAYASHI HIDEKI;MURAMATSU MASAFUMI |
分类号 |
H01L27/146;H01L21/50;H01L27/14;H04N5/335;H04N5/369;H04N5/374 |
主分类号 |
H01L27/146 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|