| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a stack-type semiconductor device that is miniaturized without disconnecting a lead wire. <P>SOLUTION: In the stack-type semiconductor device where a plurality of devices are laminated on a frame substrate having a plurality of outer lead terminals, the plurality of devices in which an electrode is arranged on an inclined surface formed at an outer periphery are laminated on the frame substrate by an insulating adhesive, and the electrode arranged on the inclines surface is connected to the outer lead terminal by a lead wire. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
