发明名称 |
MICROSYSTEM COMPONENT WITH A DEVICE DEFORMABLE UNDER THE EFFECT OF TEMPERATURE CHANGES |
摘要 |
A microsystem component with a device (3) deformable under the influence of temperature changes is disclosed. The device comprises at least one first (4, 5) and second (8) element with differing thermal expansion coefficients and different thermal conductivities. The elements (4, 5; 8) are physically separate and arranged and connected to each other such that the device (3) assumes flexure states which are dependent on the temperature.
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申请公布号 |
US2009213900(A1) |
申请公布日期 |
2009.08.27 |
申请号 |
US20060813308 |
申请日期 |
2006.01.04 |
申请人 |
RANGELOW IVO;IVANOV TZVETAN;IVANOVA KATERINA |
发明人 |
RANGELOW IVO;IVANOV TZVETAN;IVANOVA KATERINA |
分类号 |
G01K5/00 |
主分类号 |
G01K5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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