| 摘要 |
Methods and systems for a balun embedded in an integrated circuit package are disclosed and may include a multi-layer package bonded to an integrated circuit. The multi-layer package may include an integrated balun which may be enabled to process RF signals received from and/or communicated to an antenna. The integrated circuit may be flip-chip bonded to the multi-layer package. The balun may include ferromagnetic layers integrated in the multi-layer package, and may be bypassed via bypass switches integrated in the multi-layer package. The switches integrated in the multi-layer package may include MEMS switches. The balun may be bypassed via bypass switches in the integrated circuit. The switches in the integrated circuit may include CMOS switches. The balun may be impedance matched to the integrated circuit via surface mount devices, which may be coupled to the multi-layer package.
|
