| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device that prevents wiring deformation or disconnection on an insulating film, and to provide a display apparatus using the semiconductor device. <P>SOLUTION: A semiconductor element 4 is disposed on wiring provided on one surface of the insulating film 1. A plate-like heat dissipating material 7 having a high thermal conductivity is disposed on the other surface of the insulating film 1, in a position corresponding to the semiconductor element 4 and its surrounding. The heat dissipating material 7 is provided with a slit 8 for modifying a thermal expansion stress. <P>COPYRIGHT: (C)2009,JPO&INPIT |
