发明名称 POLISHING PAD, POLISHING PAD MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a polishing pad which is highly hydrophilic, ensures high dimensional stability when moisture or water is absorbed, and is improved in abrasion resistance during polishing operation. <P>SOLUTION: The polishing pad is formed of a polishing layer consisting of: an isocyanate terminal prepolymer A; an isocyanate terminal prepolymer B; and a polyurethane foamed body. The isocyanate terminal prepolymer A is obtained by reacting a prepolymer raw material composition containing a di-isocyanate, a polymeric polyol a, and a monomeric polyol. The isocyanate terminal prepolymer B is obtained by reacting a prepolymer raw material composition containing a modified isocyanate polymerized by adding three or more di-isocyanates to each other, and a polymeric polyol b having a number average molecular weight of 1,000 to 2,000, and has an NCOindex (equivalence ratio of an isocyanate group to an active hydrogen group) of 3.5 to 7.0. The polyurethane foamed body is a reaction curable body of a polyurethane raw material composition containing a chain-extending agent, and has micropores formed therein. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009190121(A) 申请公布日期 2009.08.27
申请号 JP20080033265 申请日期 2008.02.14
申请人 TOYO TIRE & RUBBER CO LTD 发明人 NAKAI YOSHIYUKI;KIMURA TAKESHI;SHIMOMURA TETSUO;KAZUNO ATSUSHI;OGAWA KAZUYUKI;NAKAMURA KENJI;SEYANAGI HIROSHI
分类号 B24B37/20;B24B37/24;C08G18/10;C08G18/66;C08G101/00;H01L21/304 主分类号 B24B37/20
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