| 摘要 |
PROBLEM TO BE SOLVED: To miniaturize more a semiconductor device while securing the necessary number of its connecting terminals. SOLUTION: With respect to the semiconductor device having a substrate 2, a semiconductor element 3 mounted on the surface of the substrate, a mold resin portion 4 so formed on the surface of the substrate as to cover the semiconductor element 3 with it, and a plurality of connecting terminals 5 disposed on the surface of the substrate which is present on the outer peripheral side the resin mold 4, in a region B corresponding to a resin passage of a mold die which is present in the outer-peripheral-side region of the resin mold portion 4, a plurality of metal surfaces 18, 19 used as resin peeling portions having weak bonding strength to the mold resin are so arranged at a proper space in a direction along the resin passage as to dispose at least one connecting terminal 5 between the metal surfaces. COPYRIGHT: (C)2009,JPO&INPIT
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