| 摘要 |
PROBLEM TO BE SOLVED: To provide a housing structure of a module capable of reducing EMI by enhancing the contactability between a base member and a cover. SOLUTION: In the housing structure 100 of the module, a cover 2 composed of a flexible material is attached over a base member 1 housing a wiring board 3. Claws 10 and spring members 13 are provided on side plates 2B to 2D of the cover 2. Slits 11 for claws engaged with the claws 10 and slits 14 for spring member for allowing the spring member 13 to pass through and pressing a bottom plate 1A of the base member 1 to the spring member 13, are formed on side plates 1B to 1D of the base member 1 contacted with or positioned adjacent to the side plates 2B to 2D of the cover 2. COPYRIGHT: (C)2009,JPO&INPIT
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