发明名称 INJECTION MOLDING APPARATUS, AND METHOD FOR COOLING INJECTION-MOLDED PRODUCT
摘要 PROBLEM TO BE SOLVED: To provide a cooling method applicable also to a die of an injection molding apparatus without an insert and improving the cooling efficiency of an injection-molded product to shorten a molding cycle. SOLUTION: This injection molding apparatus comprises: an ejector pin 5 movable so that an abutting surface 7 takes each position of a molding position O, a retreat position P retreated by a predetermined stroke from the molding position O, and a projecting position Q projected from the molding position O; a space part 8 formed between the abutting surface 7 of the ejector pin 5 and a cavity 20 when the ejector pin 5 shifts into the retreat position P; a lead-in passage 9 for leading a refrigerant B into the space part 8; and a discharge passage 10 for discharging the refrigerant B led into the space part 8, to the outside. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009190381(A) 申请公布日期 2009.08.27
申请号 JP20080036550 申请日期 2008.02.18
申请人 SEIKO EPSON CORP 发明人 YAMASHITA SEIICHIRO;MIYAZAKI KENTARO;SHIOBARA KEIICHI;YOKOTA HIROSHI
分类号 B29C45/73 主分类号 B29C45/73
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