| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing tool performing ultrafine machining by using a carbon nano-material including carbon nanotubes having a diameter from several nanometers to several tens of nanometers. SOLUTION: It is required to precisely machine a semiconductor such as silicon which is a material for an electronic component, metallic products of steel and aluminum, and ceramic articles for daily use. For polishing the surfaces of those materials, the polishing tool having a polishing base material composed of abrasive grains such as corundum, diamond, and CBN, bonded by binder is used. However, machining accuracy for polishing is limited to micron-size since the size of those abrasive grains is micron-size. The carbon nano-material including the carbon nanotubes having a diameter from several nanometers to several tens of nanometers is conventionally known, a nanometer being 1/1,000 of micrometer. As the polishing tool uses the carbon nano-material as abrasive grains, the polishing tool can polish a polishing object at a nano-size accuracy and is superior in durability. COPYRIGHT: (C)2009,JPO&INPIT
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