WIRE ELECTRIC DISCHARGE MACHINING METHOD, SEMICONDUCTOR WAFER MANUFACTURING METHOD, AND SOLAR BATTERY CELL MANUFACTURING METHOD

摘要

Provided are a wire electric discharge machining method for poorly conductive materials, such as solar cell silicon, and a semiconductor wafer manufacturing method and a solar battery cell manufacturing method based on the wire electric discharge machining method. Electrical discharge machining of a high volume resistivity, hard and brittle materials, having a volume resistivity that is equal to or higher than 0.5 Omega.cm and equal to or lower than 5 Omega.cm is performed by applying a pulse voltage having a pulse width that is equal to or higher than 1 musec and equal to or lower than 4 musec and having a peak current at the time of machining a wire electrode that is equal to or higher than 10A and equal to or lower than 50A to a wire electrode and generating a discharge pulse between the wire electrode and a subject to be machined.