发明名称 Laminating adhesive for demoulding at elevated temperature
摘要 The present invention relates to a laminating adhesive composition which contains a reaction product which contains isocyanate groups and which is obtained from the reaction of at least two specific polyester polyols, solid at room temperature, and a polyisocyanate. Particularly in the case of three-dimensionally deformed support material surfaces, the laminating adhesive compositions permit removal from the laminating mould at an elevated temperature.
申请公布号 US2009214875(A1) 申请公布日期 2009.08.27
申请号 US20090379675 申请日期 2009.02.26
申请人 SIKA TECHNOLOGY AG 发明人 PASCHKOWSKI KAI
分类号 B32B27/40;C08L75/04;C08L75/06;C09J5/06 主分类号 B32B27/40
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