发明名称 |
METHOD OF MANUFACTURING LIGHT EMITTING DIODE DEVICE |
摘要 |
A method of manufacturing light-emitting diode device has steps of isolating a light-emitting side of an LED chip from a wire-bonding region by disposing partition panels on the wire-bonding region and coating phosphors on the light-emitting side of the LED chip in a phosphor-coating process. The method can be applied to manufacturing LED device having a flip chip structure or a vertical chip structure. According to the method, a white LED device can be directly manufactured without adopting a phosphor package technique, and thereby a whole package process of the white LED device is simplified.
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申请公布号 |
US2009215210(A1) |
申请公布日期 |
2009.08.27 |
申请号 |
US20090351668 |
申请日期 |
2009.01.09 |
申请人 |
HE SHAN LIDE ELECTRONIC ENTERPRISE COMPANY LTD. |
发明人 |
FAN BEN;WENG HSIN-CHUAN;YEH KUO-KUANG |
分类号 |
H01L33/00;H01L33/50 |
主分类号 |
H01L33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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