<p>Provided is a polymer compound that is a photoresist composition able to form photoresist films having excellent acid reactivity and thermal stability, minimal swelling during development, and a refractive index at a 193 nm wavelength of preferably 1.72 or higher, and that is for obtaining photoresist compositions able to be patterned as photoresist films, and that has the below compound as at least one of the starting materials.</p>
