发明名称 |
ATOMIC LAYER DEPOSITION APPARATUS AND ATOMIC LAYER DEPOSITION METHOD |
摘要 |
<p>An atomic layer deposition apparatus comprises a first chamber surrounded by a wall in which a reactive gas supply hole is formed, a second chamber surrounded by a wall in which a material gas supply hole is formed, an antenna array consisting of a plurality of rod antenna elements provided in parallel in the first chamber in order to generate plasma by using the reactive gas, a substrate stage provided in the second chamber for mounting a substrate, and a connection member for connecting the first chamber with the second chamber in order to supply a gas containing radicals generated by the antenna array from the first chamber to the second chamber.</p> |
申请公布号 |
WO2009104379(A1) |
申请公布日期 |
2009.08.27 |
申请号 |
WO2009JP00634 |
申请日期 |
2009.02.17 |
申请人 |
MITSUI ENGINEERING & SHIPBUILDING CO., LTD.;TACHIBANA, HIROYUKI |
发明人 |
TACHIBANA, HIROYUKI |
分类号 |
H01L21/31;C23C16/452;H05H1/46 |
主分类号 |
H01L21/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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