发明名称 ATOMIC LAYER DEPOSITION APPARATUS AND ATOMIC LAYER DEPOSITION METHOD
摘要 <p>An atomic layer deposition apparatus comprises a first chamber surrounded by a wall in which a reactive gas supply hole is formed, a second chamber surrounded by a wall in which a material gas supply hole is formed, an antenna array consisting of a plurality of rod antenna elements provided in parallel in the first chamber in order to generate plasma by using the reactive gas, a substrate stage provided in the second chamber for mounting a substrate, and a connection member for connecting the first chamber with the second chamber in order to supply a gas containing radicals generated by the antenna array from the first chamber to the second chamber.</p>
申请公布号 WO2009104379(A1) 申请公布日期 2009.08.27
申请号 WO2009JP00634 申请日期 2009.02.17
申请人 MITSUI ENGINEERING & SHIPBUILDING CO., LTD.;TACHIBANA, HIROYUKI 发明人 TACHIBANA, HIROYUKI
分类号 H01L21/31;C23C16/452;H05H1/46 主分类号 H01L21/31
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