发明名称 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition or the like having excellent photosensitive characteristics such as high resolution and high sensitivity. <P>SOLUTION: The positive photosensitive resin composition contains: (A) a polyimide precursor where part of a hydroxyl group contained in a molecule is substituted by a group represented by general formula (I); and (B) a compound having a quinone diazide structure. In the formula, R<SP>1</SP>, R<SP>2</SP>and R<SP>3</SP>may be the same or different and each represent a substituted or unsubstituted alkyl, a substituted or unsubstituted aryl or a substituted or unsubstituted aralkyl, or R<SP>1</SP>and R<SP>2</SP>may form a cycloalkyl together with adjacent carbon atoms, or R<SP>2</SP>and R<SP>3</SP>may form an oxygen-containing heterocycle together with adjacent C-C-O. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009192760(A) 申请公布日期 2009.08.27
申请号 JP20080032577 申请日期 2008.02.14
申请人 KYOWA HAKKO CHEMICAL CO LTD 发明人 HASEGAWA MASATOSHI;MURAYAMA SHUNICHI;KOMAI MASATSUGU;NUMAZAKI REI
分类号 G03F7/023;C08G73/10;H01L21/027 主分类号 G03F7/023
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