| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate grinding device which horizontally holds a substrate and carries out a stable machining. SOLUTION: The substrate machining device 100 is formed of: a stage 2 on which the substrate W is mounted: first and second suction portions formed in the stage 2, for sucking the substrate W; a switching portion 3 for switching ON/OFF states of the first and second suction portions; and a machining probe 20 for carrying out operation on the substrate W. The switching portion 3 turns on one of the first and second suction portions according to the location of the machining probe 20, and turns off the other. COPYRIGHT: (C)2009,JPO&INPIT |
