| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that it is difficult to accept a conventional insulating substrate to a compact electronic component when only a mounting portion for an electronic component etc., is made locally high in performance (for higher heat dissipation and higher tensile strength). SOLUTION: A heat dissipation substrate 11 is provided with a wiring 16 formed of a lead frame 19, wherein the wiring is made locally high in performance (for higher heat dissipation and high tensile strength) by: providing a recess 20 in part of the wiring 16 protruding portions of the recess 20 from the wiring 16 to the right and the left; and burying them in a heat transfer layer 14. Accordingly, the heat dissipation substrate is adaptive to mounting of a compact electronic component 21. COPYRIGHT: (C)2009,JPO&INPIT |
