| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device which can prevent damage occurring at an electrical signal connecting portion effectively when a plurality of wafers are stuck, and can ensure excellent reliability and stabilized performance. <P>SOLUTION: Electrical signal connecting portions 9, 26 are formed on the surface 30a, 30b of a wafer 1WA, 1WB which are stuck to another wafer, and the electrical signal connecting portions of one wafer are connected electrically with the electrical signal connecting portions of another wafer facing that wafer, wherein at least one of the electrical signal connecting portions 9 and 26 facing each other is formed to be protruded from the sticking surface 30a, 30b, and reinforcing protrusions 5b, 9b and 26b are formed to be protruded from the sticking surface 30a, 30b with heights equal to or higher than that of the protruding connecting portion, while being insulated from a semiconductor circuit, in a region on the sticking surface 30a, 30b where the protruding connecting portion is formed but the electrical signal connecting portions 9, 26 are not arranged, thus obtaining a semiconductor device. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
