| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooler reducing dispersion of cooling efficiency of a plurality of electronic components and to provide a power converting device using the cooler. SOLUTION: The cooler 1 includes a plurality of cooling pipes 3 sandwiching the electronic components (semiconductor modules 2) and a plurality of electronic components are arranged between a pair of adjacent cooling pipes 3. The cooling pipe 3 includes a refrigerant entrance 31 and a refrigerant exit 32, and includes a refrigerant passage 33 circulating the cooling medium inside. The refrigerant passage 33 is divided into a pair of external refrigerant passages 332 and internal refrigerant passages 331 in a lamination direction X of the cooling pipe 3 by two party walls 34. The refrigerant entrance 31 is directly connected to the internal refrigerant passage 331 and the refrigerant exit 32 is directly connected to the pair of external refrigerant passages 332. On the party walls 34, opening parts 35 confronted with the plurality of electronic components are formed at the center thereof in a passage width direction Z orthogonal to a refrigerant circulation direction Y and the lamination direction X. COPYRIGHT: (C)2009,JPO&INPIT
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