| 摘要 |
PROBLEM TO BE SOLVED: To provide an especially compact semiconductor laser module. SOLUTION: The semiconductor laser module includes a module carrier with a fixing surface, a pumping device arranged on the fixing surface, a surface emission semiconductor laser arranged on the fixing surface, and a frequency converter arranged on the fixing surface, wherein the maximum fixing surface of the module carrier is 100 m<SP>2</SP>, the surface emission semiconductor laser includes a fixing block having an upper surface and a fixing surface, and at least one semiconductor laser chip arranged on the upper surface of the fixing block, the fixing surface of the fixing block extends substantially perpendicularly to the upper surface of the fixing block, and the surface emission semiconductor laser is fixed onto the fixing surface of the module carrier by the fixing surface of the module carrier. COPYRIGHT: (C)2009,JPO&INPIT |
