发明名称 |
LOW THERMAL RESISTANCE POWER MODULE ASSEMBLY |
摘要 |
A power module assembly (400) with low thermal resistance and enhanced heat dissipation to a cooling medium. The assembly includes a heat sink or spreader plate (410) with passageways or openings (414) for coolant that extend through the plate from a lower surface (411) to an upper surface (412). A circuit substrate (420) is provided and positioned on the spreader plate (410) to cover the coolant passageways. The circuit substrate (420) includes a bonding layer (422) configured to extend about the periphery of each of the coolant passageways and is made up of a substantially nonporous material. The bonding layer (422) may be solder material which bonds to the upper surface (412) of the plate to provide a continuous seal around the upper edge of each opening (414) in the plate. The assembly includes power modules (430) mounted on the circuit substrate (420) on a surface opposite the bonding layer (422). The power modules (430) are positioned over or proximal to the coolant passageways.
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申请公布号 |
US2009213546(A1) |
申请公布日期 |
2009.08.27 |
申请号 |
US20050569248 |
申请日期 |
2005.10.18 |
申请人 |
HASSANI VAHAB;VLAHINOS ANDREAS;BHARATHAN DESIKAN |
发明人 |
HASSANI VAHAB;VLAHINOS ANDREAS;BHARATHAN DESIKAN |
分类号 |
H05K7/20;B21D53/00 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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