| 摘要 |
<p>An aligner which has a simple mechanism, can be easily adjusted, occupies less space, and is highly accurate. The minimum distance (d2) and the maximum distance (d3) between a rotating axis (5a) and an outer peripheral position of a wafer (4) are measured by a line sensor (3), the difference (d4) between the minimum and maximum distances (d2, d3) is calculated based on data obtained by the measurement, and the rotation of the rotating axis (5a) is stopped at either a state in which the outer peripheral position of the wafer (4) is located at the minimum distance or a state in which the outer peripheral position of the wafer (4) is located at the maximum distance. Then, a first drive section (7) is driven, with a lift pin (6) located at a lowered position, to move the lift pin (6) by half the measured difference (d4). Then the pin (6) is lifted by drive of a second drive section (8), and a vacuum (9) is operated to convey the wafer (4) in the X-axis direction by half the measured difference (d4) with the wafer (4) held at the lift pin (6) by a vacuum chuck provided to the lift pin (6).</p> |
