发明名称 BONDING BASE, METHOD FOR MANUFACTURING BONDING BASE, METHOD FOR MANUFACTURING BONDED MATERIAL, AND LIQUID DROP EJECTING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a bonding base that can maintain bonding strength and durability even when the base has a large surface roughness and a concavo-convex pattern or steps present on the surface, or has a small contact area where base materials to be bonded are in contact with each other. SOLUTION: The bonding base 100 has a bonding layer 150 formed by stacking bonding films 120, 130, 140 into a three-layer structure on one surface 114 of the base 110. Each bonding film 120, 130, 140 is formed by subjecting each thin film essentially comprising polyorganosiloxane containing an alkyl group to activation processing by irradiation with UV rays as an embodiment of energy rays. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009190299(A) 申请公布日期 2009.08.27
申请号 JP20080034124 申请日期 2008.02.15
申请人 SEIKO EPSON CORP 发明人 MATSUO YASUHIDE;OTSUKA KENJI;HIGUCHI KAZUHISA;WAKAMATSU KOSUKE;KOBAYASHI MASANAO
分类号 B41J2/16;B41J2/045;B41J2/055 主分类号 B41J2/16
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