| 摘要 |
<P>PROBLEM TO BE SOLVED: To grind a wafer with high flatness to finish it with high quality in an efficient manner with low probability of deformation and damage during the grinding. <P>SOLUTION: A carrier 2 for use in grinding both surfaces of a wafer includes a plate 10 disk-shaped with a thickness of 0.15 mm or less and revolved around an axial line L1 while rotating between both grinding plates via a gear 10a; a rectangular wafer storage hole 11 in a plan view formed with a position eccentric from the center G1 of the plate as the center G2; a main clearance hole 12 with a diameter of 15 mm or larger having its center located on the center line L2 connecting between the centers of the plate and the wafer storage hole and formed at an approximately equal distance from a circumference of the plate and the wafer storage hole; and sub clearance holes 13 with a diameter of 10 mm or larger, which are formed at a distance of 5 mm or larger from each of the circumference of the plate, the wafer storage hole and the main clearance hole, and are bilaterally symmetric with respect to the center line. <P>COPYRIGHT: (C)2009,JPO&INPIT |
