| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a chip type jumper which can be easily produced even when made compact. <P>SOLUTION: The chip type jumper includes an insulating substrate 11, a conductor portion 12 provided on an upper surface of the insulating substrate 11, a protective film 13 provided so as to cover the conductor portion 12, and end electrodes 14 provided at both ends of the insulating substrate 11 and electrically connected to the conductor portion 12, wherein the conductor portion 12 is formed of nanopaste of Au or Ag, or formed by frame-spraying Cu, Al or Ni, or alloy containing them. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
