发明名称 |
ELECTRONIC COMPONENT, ELECTRONIC EQUIPMENT, AND BASE MEMBER MANUFACTURING METHOD |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic component capable of withstanding stress from a printed board or the like. <P>SOLUTION: In the electronic component 1a, a cavity 9 tight-sealed by a base 2 and a lid 5 is formed and a quartz vibrator 6 is held above an upper surface of the base 2 by a support 7 in the cavity 9. The base 2 is made of glass and a stress relief layer 3 made of a conductive resin is formed over the entire bottom surface of the base 2. External electrodes 8 and 4 conducting an electrode of the quartz vibrator 6 reach down to the bottom of the stress relief layer 3 respectively along side faces of the base 2 and the stress relief layer 3. The electronic component 1a so constituted is surface-mounted by soldering the external electrodes 8 and 4 formed on the bottom parts of the stress relief layer 3 to the printed board. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
申请公布号 |
JP2009194091(A) |
申请公布日期 |
2009.08.27 |
申请号 |
JP20080032046 |
申请日期 |
2008.02.13 |
申请人 |
SEIKO INSTRUMENTS INC |
发明人 |
TAKEUCHI HITOSHI;SATO KEIJI;ARATAKE KIYOSHI;NUMATA SATOSHI |
分类号 |
H01L23/02;H01L41/09;H01L41/18;H03H3/02;H03H9/02 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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