| 摘要 |
PROBLEM TO BE SOLVED: To provide a means for reducing degradation in throughput even when the pixel size at the time of inspection must be reduced to deal with microfabrication of a circuit pattern. SOLUTION: The inspection method and the inspection apparatus acquire the images from signals generated by irradiating a charged particle beam onto a sample to be inspected 9 with a circuit pattern, and detect any deficiency in the circuit pattern from such images. The inspection apparatus employs a configuration wherein the inspection pixel size in the direction where the charged particle beam is scanned onto the sample to be inspected 9 and the inspection pixel size in the traveling direction of stages 31, 32 and 33 that travel with the sample to be inspected placed thereon are separately set up for inspection. COPYRIGHT: (C)2009,JPO&INPIT |
