发明名称 |
SUBSTRATE CLEANING APPARATUS WITH TILTED PLASMA |
摘要 |
PROBLEM TO BE SOLVED: To provide a substrate cleaning apparatus for efficiently cleaning a cleaned place by obliquely irradiating a substrate with Helicon wave plasma. SOLUTION: In a plasma asher which introduces oxygen and steam into the evacuated vacuum chamber to generate the plasma at high frequency and peels resist off the substrate held horizontally, the substrate cleaning apparatus is characterized by obliquely irradiating the substrate with plasma by tilting an evacuated vacuum chamber. COPYRIGHT: (C)2009,JPO&INPIT
|
申请公布号 |
JP2009193992(A) |
申请公布日期 |
2009.08.27 |
申请号 |
JP20080030153 |
申请日期 |
2008.02.12 |
申请人 |
TSUKUBA SEMI TECHNOLOGY:KK;CV RESEARCH:KK |
发明人 |
KUWAJIMA TSUNEAKI;NAKATSU MAKIHITO;SUDO AKIHIRO;KAWAURA HIROSHI;FUJIWARA KOSUKE;KOMOTO TETSUYA;OTA MAMORU |
分类号 |
H01L21/304;H01L21/3065 |
主分类号 |
H01L21/304 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|