发明名称 SUBSTRATE CLEANING APPARATUS WITH TILTED PLASMA
摘要 PROBLEM TO BE SOLVED: To provide a substrate cleaning apparatus for efficiently cleaning a cleaned place by obliquely irradiating a substrate with Helicon wave plasma. SOLUTION: In a plasma asher which introduces oxygen and steam into the evacuated vacuum chamber to generate the plasma at high frequency and peels resist off the substrate held horizontally, the substrate cleaning apparatus is characterized by obliquely irradiating the substrate with plasma by tilting an evacuated vacuum chamber. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009193992(A) 申请公布日期 2009.08.27
申请号 JP20080030153 申请日期 2008.02.12
申请人 TSUKUBA SEMI TECHNOLOGY:KK;CV RESEARCH:KK 发明人 KUWAJIMA TSUNEAKI;NAKATSU MAKIHITO;SUDO AKIHIRO;KAWAURA HIROSHI;FUJIWARA KOSUKE;KOMOTO TETSUYA;OTA MAMORU
分类号 H01L21/304;H01L21/3065 主分类号 H01L21/304
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