| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy-silicone composite resin composition which gives a transparent cured product without deteriorating the transparency even on reflowing, suitable as a coating protective material for a light-emitting semiconductor element, and a light-emitting semiconductor device using the same. SOLUTION: The epoxy-silicone composite resin composition comprises (A) an organopolysiloxane having two or more epoxy groups, represented by the average composition formula: R<SP>1</SP><SB>m</SB>R<SP>2</SP><SB>n</SB>(OH)<SB>a</SB>SiO<SB>(4-m-n-a)/2</SB>(wherein R<SP>1</SP>is an organic group containing a 2-8C epoxy group; R<SP>2</SP>is independently a 1-6C alkyl group, a 2-6C alkenyl group or a phenyl group; m and n are positive numbers which meet 0<m<1, 0<n<2, and 1<m+n≤2; and a is a number which meets 0<a<2), (B) an epoxy resin having two or more epoxy groups without containing a silicon atom, (C) a curing agent, (D) a curing catalyst containing a quaternary phosphonium salt, and (E) an antioxidant. COPYRIGHT: (C)2009,JPO&INPIT
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