CONDUCTIVE FILM FORMING SUBSTRATE, CONDUCTIVE FILM, AND MANUFACTURING METHOD OF CONDUCTIVE FILM

摘要

PROBLEM TO BE SOLVED: To suppress uneven application of an ink accepting layer, also to reduce haze and to prevent bleeding in performing photogravure or the like. SOLUTION: A conductive film forming substrate includes a supporting body and an ink accepting layer formed on the supporting body. The ink accepting layer contains inorganic particles and resin, and a refractive index difference between the inorganic particles and the resin is within 0.05 and the grain size of the inorganic particles 0.12-0.50μm. The inorganic particles are desirably silica and the resin can use ethyl cellulose or acrylic. The thickness of the ink accepting layer is 10-50μm. COPYRIGHT: (C)2009,JPO&INPIT