FLAT LEADLESS PACKAGES AND STACKED LEADLESS PACKAGE ASSEMBLIES
摘要
A flat leadless package includes at least one die mounted onto a leadframe and electrically connected to leads using an electrically conductive polymer or an electrically conductive ink. Also, an assembly includes stacked leadless packages electrically connected to leads using an electrically conductive polymer or an electrically conductive ink. Also, a package module includes an assembly of stacked leadless packages mounted on a support and electrically connected to circuitry in the support using an electrically conductive polymer or an electrically conductive ink.
申请公布号
WO2009105449(A2)
申请公布日期
2009.08.27
申请号
WO2009US34368
申请日期
2009.02.18
申请人
VERTICAL CIRCUITS, INC.;ANDREWS, LAWRENCE, DOUGLAS;LEAL, JEFFREY, S.;MCELREA, SIMON, J., S.
发明人
ANDREWS, LAWRENCE, DOUGLAS;LEAL, JEFFREY, S.;MCELREA, SIMON, J., S.